american microsystems, inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2.28.02 fs6244 fs6244 fs6244 fs6244 dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic iso9001 iso9001 iso9001 iso9001 1.0 features ? dual phase-locked loop (pll) device with three out- put clock frequencies ? on-chip crystal oscillator for reference frequency generation ? 3.3v or 5v supply voltage available ? small circuit board footprint (16-pin 0.150 soic) ? custom frequency selections available - contact your local ami sales representative for more information figure 1: pin configuration 1 16 2 3 4 5 6 7 8 15 14 13 12 11 10 9 n/c xout xin vdd vss clka n/c n/c n/c clkc vss n/c vdd clkb n/c n/c fs6244 16-pin (0.150 ) soic 2.0 description the fs6244 is a monolithic cmos clock generator ic designed to minimize cost and component count in digital video/audio systems. two high-resolution phase-locked loops generate three output clocks through an array of post-dividers. all fre- quencies are ratiometrically derived from the crystal os- cillator frequency. the locking of all the output frequen- cies together can eliminate unpredictable artifacts in video systems and reduce electromagnetic interference (emi) due to frequency harmonic stacking. table 1: version information device vdd (nom) f xin (mhz) clka (mhz) clkb (mhz) clkc (mhz) fs6244-03 5 27.000 11.2896 (+1.1 ppm) 3.6864 27.000 note: contact ami for custom versions figure 2: block diagram crystal osc. fs6244 pll xout xin clkc clka divider array pll clkb
2 2.28.02 fs6244 fs6244 fs6244 fs6244 dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic iso9001 iso9001 iso9001 iso9001 table 2: pin descriptions key: ai = analog input; ao = analog output; di = digital input; di u = input with internal pull-up; di d = input with internal pull-down; dio = digital input/output; di-3 = three-level digital input, do = digital output; p = power/ground; # = active low pin pin type name description 1 - n/c no connection 2 ao xout crystal oscillator drive 3 ai xin crystal oscillator feedback 4 p vdd power supply (+3.3v or +5v) 5 p vss ground 6doclkaclock output a 7 - n/c no connection 8 - n/c no connection 9 - n/c no connection 10 do clkc clock output c 11 p vss ground 12 - n/c no connection 13 p vdd power supply (+3.3v or +5v) 14 do clkb clock output b 15 - n/c no connection 16 - n/c no connection 3.0 functional block description 3.1 phase-locked loop (pll) the on-chip plls are a standard frequency- and phase- locked loop architecture. the pll multiplies the reference oscillator to the desired frequency by a ratio of integers. the frequency multiplication is exact with a zero synthe- sis error unless otherwise indicated in the frequency ta- ble. 3.2 crystal oscillator the crystal oscillator provides a stable, low-jitter fre- quency reference for the rest of the fs6244 system com- ponents. loading capacitance for the crystal is internal to the fs6244. no external components (other than the resonator itself) are required for operation of the crystal oscillator.
3 2.28.02 fs6244 fs6244 fs6244 fs6244 dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic iso9001 iso9001 iso9001 iso9001 4.0 electrical specifications table 3: absolute maximum ratings stresses above those listed under absolute maximum ratings may cause permanent damage to the device. these conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. exposure to maximum rati ng conditions for extended conditions may affect device performance, functionality, and reliability. parameter symbol min. max. units supply voltage (v ss = ground) v dd v ss -0.5 7 v input voltage, dc v i v ss -0.5 v dd +0.5 v output voltage, dc v o v ss -0.5 v dd +0.5 v input clamp current, dc (v i < 0 or v i > v dd )i ik -50 50 ma output clamp current, dc (v i < 0 or v i > v dd )i ok -50 50 ma storage temperature range (non-condensing) t s -65 150 c ambient temperature range, under bias t a -55 125 c junction temperature t j 125 c lead temperature (soldering, 10s) 260 c input static discharge voltage protection (mil-std 883e, method 3015.7) 2 kv caution: electrostatic sensitive device permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy ele c- trostatic discharge. table 4: operating conditions parameter symbol conditions/description min. typ. max. units supply voltage (3.3 volt system) v dd see note 1 3.0 3.3 3.6 v supply voltage (5.0 volt system) v dd see note 1 4.5 5.0 5.5 v ambient operating temperature range t a see note 1 0 70 c crystal resonator frequency f xtal fundamental mode 5 27 mhz note 1: these specifications represent generic fs6244 device capability. device specifications for a particular version (i.e. fs6244-xx) are guaranteed only with the operating voltage and refer- ence frequency specified in version information.
4 2.28.02 fs6244 fs6244 fs6244 fs6244 dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic iso9001 iso9001 iso9001 iso9001 table 5: dc electrical specifications (v dd = 3.3v nominal) unless otherwise stated, v dd = 3.3v 10%, no load on any output, and ambient temperature range t a = 0c to 70c. parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. where given, min and max characterization data are 3 from typical. negative currents indicate current flows out of the device. parameter symbol conditions/description min. typ. max. units overall supply current, dynamic, with loaded outputs i dd f xtal = 27mhz; c l = 10pf, v dd = 3.3v (depends on output frequencies) 15 ma crystal oscillator crystal loading capacitance c l(xtal) as seen by a crystal connected to xin and xout 17 pf crystal drive level r xtal =20 ? ; 200 uw crystal oscillator feedback (xin) threshold bias voltage v th 860 mv high-level input current i ih 34 a low-level input current i il -21 a crystal oscillator drive (xout) high-level output source current i oh v(xin) = 0v, v o = 0v -0.5 ma low-level output sink current i ol v(xin) = 3.3v, v o = 3.3v 15 ma clock outputs (clkx) high-level output source current * i oh v o = 2.0v -40 ma low-level output sink current * i ol v o = 0.4v 17 ma short circuit source current * i osh v o = 0v; shorted for 30s, max. -55 ma short circuit sink current * i osl v o = 3.3v; shorted for 30s, max. 55 ma
5 2.28.02 fs6244 fs6244 fs6244 fs6244 dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic iso9001 iso9001 iso9001 iso9001 table 6: dc electrical specifications (v dd = 5v nominal) unless otherwise stated, v dd = 5.0v 10%, no load on any output, and ambient temperature range t a = 0c to 70c. parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. where given, min and max characterization data are 3 from typical. negative currents indicate current flows out of the device. parameter symbol conditions/description min. typ. max. units overall supply current, dynamic, with loaded outputs i dd f xtal = 27mhz; c l = 10pf, v dd = 5.0v (-03 version) 25 ma crystal oscillator crystal loading capacitance c l(xtal) as seen by a crystal connected to xin and xout 17 pf crystal drive level r xtal =20 ? ; 300 uw crystal oscillator feedback (xin) threshold bias voltage v th 950 mv high-level input current i ih 50 a low-level input current i il -21 a crystal oscillator drive (xout) high-level output source current i oh v(xin) = 0v, v o = 0v -1 ma low-level output sink current i ol v(xin) = 5v, v o = 5v 20 ma clock outputs (clkx) high-level output source current * i oh v o = v dd ?0.4v -25 ma low-level output sink current * i ol v o = 0.4v 25 ma short circuit source current * i osh v o = 0v; shorted for 30s, max. -80 ma short circuit sink current * i osl v o = 5v; shorted for 30s, max. 80 ma
6 2.28.02 fs6244 fs6244 fs6244 fs6244 dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic iso9001 iso9001 iso9001 iso9001 table 7: ac timing specifications (v dd = 3.3v nominal) unless otherwise stated, v dd = 3.3v 10%, no load on any output, and ambient temperature range t a = 0c to 70c. parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. where given, min and max characterization data are 3 from typical. parameter symbol conditions/description clock (mhz) min. typ. max. units overall synthesis error (unless otherwise noted in frequency table) 0 ppm clock output (clkx) duty cycle * ratio of high pulse width (as measured from rising edge to next falling edge at v dd /2) to one clock period 45 55 % jitter, period (peak-peak) * t j( ? p) from rising edge to next rising edge at v dd /2, c l = 10pf 390 ps jitter, long term ( y ( )) * t j(lt) from 0-500 s at v dd /2, c l = 10pf compared to ideal clock source 155 ps rise time * t r v dd = 3.3v; v o = 0.3v to 3.0v; c l = 10pf 1.7 ns fall time * t f v dd = 3.3v; v o = 3.0v to 0.3v; c l = 10pf 1.7 ns table 8: ac timing specifications (v dd = 5v nominal) unless otherwise stated, v dd = 3.3v 10%, no load on any output, and ambient temperature range t a = 0c to 70c. parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. where given, min and max characterization data are 3 from typical. parameter symbol conditions/description clock (mhz) min. typ. max. units overall synthesis error (unless otherwise noted in frequency table) 0 ppm clock output (clkx) duty cycle * ratio of high pulse width (as measured from rising edge to next falling edge at v dd /2) to one clock period 45 55 % jitter, period (peak-peak) * t j( ? p) from rising edge to next rising edge at v dd /2, c l = 10pf 390 ps jitter, long term ( y ( )) * t j(lt) from 0-500 s at v dd /2, c l = 10pf compared to ideal clock source 155 ps rise time * t r v dd = 5v; v o = 0.5v to 4.5v; c l = 10pf 1.0 ns fall time * t f v dd = 5v; v o = 4.5v to 0.5v; c l = 10pf 1.0 ns
7 2.28.02 fs6244 fs6244 fs6244 fs6244 dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic dual vcxo clock generator ic iso9001 iso9001 iso9001 iso9001 5.0 package information table 9: 16-pin soic (0.150") package dimensions dimensions inches millimeters min. max. min. max. a 0.061 0.068 1.55 1.73 a1 0.004 0.0098 0.102 0.249 a2 0.055 0.061 1.40 1.55 b 0.013 0.019 0.33 0.49 c 0.0075 0.0098 0.191 0.249 d 0.386 0.393 9.80 9.98 e 0.150 0.157 3.81 3.99 e 0.050 bsc 1.27 bsc h 0.230 0.244 5.84 6.20 h 0.010 0.016 0.25 0.41 l 0.016 0.035 0.41 0.89 0 8 0 8 be d a 1 seating plane h e 16 1 all radii: 0.005" to 0.01" base plane a 2 c l 7 typ. h x 45 a american microsystems, inc. r table 10: 16-pin soic (0.150") package characteristics parameter symbol conditions/description typ. units thermal impedance, junction to free-air 16-pin 0.150? soic ja air flow = 0 m/s 109 c/w corner lead 4.0 lead inductance, self l 11 center lead 3.0 nh lead inductance, mutual l 12 any lead to any adjacent lead 0.4 nh lead capacitance, bulk c 11 any lead to v ss 0.5 pf
8 2.28.02 fs6244 fs6244 fs6244 fs6244 dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic dual pll clock generator ic iso9001 iso9001 iso9001 iso9001 6.0 ordering information table 11: device ordering codes ordering code device number package type operating temperature range shipping configuration 11640-821 fs6244-03 16-pin (0.150?) soic (small outline package) 0 c to 70 c (commercial) tape and reel 11640-831 fs6244-03 16-pin (0.150?) soic (small outline package) 0 c to 70 c (commercial) tubes 7.0 revision information date page description 4/24/00 5, 7 fixed formatting errors copyright ? 1999, 2000 american microsystems, inc. devices sold by ami are covered by the warranty and patent indemnification provisions appearing in its terms of sale only. ami makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the fr eedom of the described devices from patent infringement. ami makes no warranty of merchantability or fitness for any purposes. ami re - serves the right to discontinue production and change specifications and prices at any time and without notice. ami?s products are intended for use in commercial applications. applications requiring extended temperature range, unusual environmental require- ments, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recom- mended without additional processing by ami for such applications. american microsystems, inc., 2300 buckskin rd., pocatello, id 83201, (208) 233-4690, fax (208) 234-6796, www address: http://www.amis.com e-mail: tgp@amis.com
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